About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

This engineer will be responsible for will include negotiating requirements with internal & external customers and leading small project teams of design and simulation engineers to deliver innovative high quality packaging solutions.

What We're Looking For

Must have:

• Bachelor's degree in Computer Science, Electrical Engineering or related fields and 15+ years of related professional experience.

• Ability to lead package development projects involving various cross functional teams like assembly development, IC physical layout teams, and Analog and Digital designers across multiple Marvell locations.

• Work experience for new product introduction from concept, through development and production

• Strong fundamentals in electrical engineering

• Strong communication, presentation, and documentation skills

Stong candidates would also have:

• Experience in using 2-D and 3-D EM simulation tools such as Ansys HFSS, SI-Wave, Cadence Clarity

• Familiarity with IC package planning & layout tools like APD or Orbit IO

• Experience with 2.5D/3D package development

• Working knowledge of circuit design tools: Spectre, ADS, HSpice

• Experience with high-speed electronic packaging for digital and analog ICs

• Power plane design, modeling and analysis using tools like PowerSI, SIwave

• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules

• Understanding, debugging and simulations of EMI/EMC problems

• Knowledge of the thermal and mechanical analysis of the IC package development

• Experience with channel simulations

#LI-TD1

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at TAOps@marvell.com.